Our CVD(Chemical Vapour Deposition) diamond thin films on Si substrates are fabricated using a superior polishing technique that we developed, achieving an RMS surface roughness of about 5 nm. The detailed specifications of these CVD diamond wafers are given below

Superior polishing technique;(Click below for Details)
An original nucleation method for making Fine and Sharp Diamond Crystal (US Pat # )

An original treatment of substrate for making Super Polished Surface (US Pat. Pending)

Substrate: 3 inch Si wafer (n type)
Substrate thickness: 1 mm
Thickness of CVD diamond: about 2 micron (center)
Surface roughness of CVD diamond: about 5nm Rms
Diamond: polycrystalline CVD diamond (non-doped)
Sample Applications


1 Gbyte-DRAM Mask made by X-ray Lithography		 Diamond is well known as the hardest material and as the most famous jewel. It has other superior properties that make it an attractive material for a wide range of electronic applications as well. These applications include membranes for x-ray lithography, substrates for surface acoustic wave filters, cold cathode electron sources, heat sinks, sensor heads, semiconductor devices, and so on. We welcome your additional suggestions.

The figure shows a 1 Gbyte-DRAM Mask made by X-ray Lithography on a  2 micron CVD Diamond thin film on Si substrates.